RSAM - Resonant Saturable Absorber Mirror, λ = 1550 nm / 1560 nm
• The RSAM can be used as optical noise suppressor, for instance after a pulse picker.
• Low intensity reflectance at resonance wavelength ≤ 1 %
See also: RSAM information.
Part-No description: RSAM-λ-τ-x
• λ - laser wavelength
• τ - absorber relaxation time
• x - mounting options
• Wavelength λ = 1550 nm
• Relaxation time τ = 10 ps
• Data sheet (pdf)
• Mounting & price table
• Order form
• Wavelength λ = 1560 nm
• Relaxation time τ = 100 ps
• Data sheet (pdf)
• Mounting & price table
• Order form
• Heat sink for chips: x = FM-1.3
• Mount / heat sink for 1.3mm x 1.3mm chips
• For fiber with FC/PC connector
• Data sheet (pdf)
• Price: 174.- €/pc
• Passive heat sink: x = PHS
• Passive heat sink for fiber coupled SAM.
• Data sheet (pdf)
• Price: 118.- €/pc
• Active heat sink: x = FC-TEC
• Heat sink for fiber coupled RSAM with thermoelectric cooler
• Data sheet (pdf)
• Price: 346.- €/pc
• x = 4.0-0
• Single chip, unmounted
• Chip area 4.0 mm x 4.0 mm
• Chip thickness 450 µm
• Data sheet (pdf)
• Price: 625.- €/pc
• x = 1.0b-0
• Batch of 4 unmounted chips
• Chip area 1.0 mm x 1.0 mm
• Chip thickness 450 µm
• Data sheet (pdf)
• Price: 625.- €/batch
• x = 1.3b-0
• Batch of 4 unmounted chips
• Chip area 1.3 mm x 1.3 mm
• Chip thickness 450 µm
• Data sheet (pdf)
• Price: 625.- €/batch
• x = 4.0-12.7g-c / 4.0-12.7g-e
• Chip area 4.0 mm x 4.0 mm
• Glued on a copper heat sink with 12.7 mm diameter
• Center mounted : x = 4.0-12.7g-c
• Edge mounted : x = 4.0-12.7g-e
• Data sheet (pdf)
• Price: 716.- €/pc
• x = 4.0-12.7s-c / 4.0-12.7s-e
• Chip area 4.0 mm x 4.0 mm
• Soldered on a copper heat sink with 12.7 mm diameter
• Center mounted : x = 4.0-12.7s-c
• Edge mounted : x = 4.0-12.7s-e
• Data sheet (pdf)
• Price: 760.- €/pc
• x = 4.0-25.0g-c / 4.0-25.0g-e
• Chip area 4.0 mm x 4.0 mm
• Glued on a copper heat sink with 25.0 mm diameter
• Center mounted : x = 4.0-25.0g-c
• Edge mounted : x = 4.0-25.0g-e
• Data sheet (pdf)
• Price: 716.- €/pc
• x = 4.0-25.0s-c / 4.0-25.0s-e
• Chip area 4.0 mm x 4.0 mm
• Soldered on a copper heat sink with 25.0 mm diameter
• Center mounted : x = 4.0-25.0s-c
• Edge mounted : x = 4.0-25.0s-e
• Data sheet (pdf)
• Price: 760.- €/pc
• x = 4.0-25.4g-c / 4.0-25.4g-e
• Chip area 4.0 mm x 4.0 mm
• Glued on a copper heat sink with 25.4 mm diameter
• Center mounted : x = 4.0-25.4g-c
• Edge mounted : x = 4.0-25.4g-e
• Data sheet (pdf)
• Price: 716.- €/pc
• x = 4.0-25.4s-c / 4.0-25.4s-e
• Chip area 4.0 mm x 4.0 mm
• Soldered on a copper heat sink with 25.4 mm diameter
• Center mounted : x = 4.0-25.4s-c
• Edge mounted : x = 4.0-25.4s-e
• Data sheet (pdf)
• Price: 760.- €/pc
• x = 4.0-25.0w-c / 4.0-25.0w-e
• Chip area 4.0 mm x 4.0 mm
• Soldered on a water cooled copper heat sink with 25.0 mm diameter
• Center mounted : x = 4.0-25.0w-c
• Edge mounted : x = 4.0-25.0w-e
• Data sheet (pdf)
• Price: 876.- €/pc
• x = FC/PC / FC/APC
• Mounted on a 1 m long single mode fiber.
• Available fibers: SMF28, Panda SM15-PS-U25D
• FC/PC connector: x = FC/PC
• FC/APC connector: x = FC/APC
• Data sheet (pdf)
• Price: 836.- €/pc